Awards & Honors

• ACM TODAES Best Paper Award, presented at the 63rd DAC, 2026, for MFIT. UW-Madison feature
• Editor’s Pick, ACM Transactions on Design Automation of Electronic Systems, 2026, for MFIT.
• First Place, ACM/IEEE DAC Ph.D. Forum, 2026, for “Cross-Layer Design of Heterogeneous Multi-Chiplet Systems for Efficient and Scalable AI Inference.”
• NSF Travel Grant, ACM/IEEE Embedded Systems Week, 2025.
• DAC Young Fellow, 61st ACM/IEEE Design Automation Conference, 2024.
• Employee of the Month, Samsung Electronics, April 2023.
• Bronze Medal, Inter IIT Tech Meet, 2019.

Invited Talks & Professional Service

• “MFIT - Multi-Fidelity Thermal Modeling,” University of California, Irvine, Prof. Nikil Dutt’s group, July 2025.
• “MFIT - Multi-Fidelity Thermal Modeling,” Wisconsin CHIPS Meeting, February 2025.
• “Runtime Monitoring of ML-based Scheduling,” UW-Madison Computer Engineering Seminar Series, October 2024.
• Reviewer for DAC, DATE, CODES, CASES, IEEE Sensors Journal, ACM TECS, IEEE TCAD, and IEEE Transactions on Computers.