Experience & Awards

Experience

ByteDance — Server Research Intern

June 2026 - August 2026 · LLM inference with heterogeneous racks

Researched MoE LLM inference across heterogeneous GPU and accelerator racks. Developed analytical modeling and expert prediction, placement, scheduling, and offloading strategies for memory-centric accelerators. Extended and validated an open-source LLM serving simulator against a production inference stack.

Ayar Labs — Architecture Research Intern

May 2025 - August 2025 · AI/ML network topology and performance analysis

Optimized a cycle-accurate NoC simulator for multi-XPU scale-up systems with co-packaged optical I/O. Studied UALink and Scale-Up Ethernet latency, packetization, bandwidth efficiency, high-bandwidth topologies, and CapEx tradeoffs.

Samsung Electronics — Senior Engineer

August 2022 - July 2023 · System architecture and digital design

Contributed to logic-logic and DRAM-logic 3D IC test chips using through-silicon vias. Worked on system architecture, IP integration, OTP memory control, performance counters, and PCIe subsystems.

Imagination Technologies — Hardware Engineer

July 2021 - August 2022 · Design automation and RTL design

Worked on automotive Ethernet packet-processing IP across RTL, lint, CDC, synthesis, power, and equivalence flows. Developed tooling for ISO 26262 safety analysis and FMEDA workflows.

Awards & Honors

• ACM TODAES Best Paper Award, presented at the 63rd DAC, 2026, for MFIT. UW-Madison feature
• Editor’s Pick, ACM Transactions on Design Automation of Electronic Systems, 2026, for MFIT.
• First Place, ACM/IEEE DAC Ph.D. Forum, 2026, for “Cross-Layer Design of Heterogeneous Multi-Chiplet Systems for Efficient and Scalable AI Inference.”
• NSF Travel Grant, ACM/IEEE Embedded Systems Week, 2025.
• DAC Young Fellow, 61st ACM/IEEE Design Automation Conference, 2024.
• Employee of the Month, Samsung Electronics, April 2023.
• Bronze Medal, Inter IIT Tech Meet, 2019.

Invited Talks & Professional Service

• “MFIT - Multi-Fidelity Thermal Modeling,” University of California, Irvine, Prof. Nikil Dutt’s group, July 2025.
• “MFIT - Multi-Fidelity Thermal Modeling,” Wisconsin CHIPS Meeting, February 2025.
• “Runtime Monitoring of ML-based Scheduling,” UW-Madison Computer Engineering Seminar Series, October 2024.
• Reviewer for DAC, DATE, CODES, CASES, IEEE Sensors Journal, ACM TECS, IEEE TCAD, and IEEE Transactions on Computers.